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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10847711
Issue Dt:
11/24/2020
Application #:
16202496
Filing Dt:
11/28/2018
Publication #:
20190173004
Pub Dt:
06/06/2019
Inventors:
Jon SLAUGHTER, Hyunwoo YANG, Sarin A. DESHPANDE, Cong HAI, Naganivetha THIYAGARAJAH et al
Title:
METHODS OF MANUFACTURING INTEGRATED CIRCUITS USING ISOTROPIC AND ANISOTROPIC ETCHING PROCESSES
Assignment: 1
Reel/Frame:
047665/0961Recorded: 12/04/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DESHPANDE, SARIN A.
Exec Dt:
12/03/2018
HAI, CONG
Exec Dt:
12/04/2018
YANG, HYUNWOO
Exec Dt:
12/04/2018
THIYAGARAJAH, NAGANIVETHA
Exec Dt:
12/04/2018
YE, SHUKAI
Exec Dt:
12/04/2018
Assignee:
EVERSPIN TECHNOLOGIES, INC.
5670 W. CHANDLER BLVD.
SUITE 100
CHANDLER, ARIZONA 85226
Correspondent:
BOOKOFF MCANDREWS, PLLC
2020 K STREET NW
SUITE 400
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
047774/0863Recorded: 12/14/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SLAUGHTER, JON
Exec Dt:
12/12/2018
Assignee:
EVERSPIN TECHNOLOGIES, INC.
5670 W. CHANDLER BLVD.
SUITE 100
CHANDLER, ARIZONA 85226
Correspondent:
BOOKOFF MCANDREWS, PLLC
2020 K STREET NW
SUITE 400
WASHINGTON, DC 20006

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