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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11466379
Issue Dt:
10/11/2022
Application #:
16211366
Filing Dt:
12/06/2018
Publication #:
20190182964
Pub Dt:
06/13/2019
Inventors:
SHIH-CHING LIN, FU-JE CHEN, KUO-CHAO CHEN
Title:
MANUFACTURING METHOD OF COPPER FOIL AND CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY SIGNAL TRANSMISSION
Assignment: 1
Reel/Frame:
048095/0774Recorded: 01/22/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIN, SHIH-CHING
Exec Dt:
11/15/2018
CHEN, FU-JE
Exec Dt:
11/15/2018
CHEN, KUO-CHAO
Exec Dt:
11/29/2018
Assignee:
NAN YA PLASTICS CORPORATION
NO. 201, TUNG HWA N. RD.
TAIPEI, TAIWAN
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031
Assignment: 2
Reel/Frame:
048825/0946Recorded: 12/06/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIN, SHIH-CHING
Exec Dt:
11/15/2018
CHEN, FU-JE
Exec Dt:
11/15/2018
CHEN, KUO-CHAO
Exec Dt:
11/29/2018
Assignee:
NAN YA PLASTICS CORPORATION
NO. 201, TUNG HWA N. RD.
TAIPEI, TAIWAN
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031

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