Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/23/2022
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Application #:
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16321873
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Filing Dt:
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01/30/2019
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Publication #:
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Pub Dt:
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06/13/2019
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Inventors:
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Yuki YAMAMOTO, Satoshi OOTANI, Mitsuyasu FURUSAWA
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Title:
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SOLDER PASTE USING A SOLDER PASTE FLUX AND SOLDER POWDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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32-1, SENJU-ASASHI-CHO, ADACHI-KU, |
TOKYO, JAPAN 120-0026 |
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CLARK & BRODY |
1700 DIAGONAL ROAD, SUITE 510 |
ALEXANDRIA, VA 22314 |
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05/21/2024 01:33 PM
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