Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16118946
|
Filing Dt:
|
08/31/2018
|
|
Publication #:
|
|
Pub Dt:
|
06/20/2019
| | | | |
|
Inventors:
|
Lejun Wang, Linlin Li, Shijia Song, Guiyong Liu, Dongyang Peng, Hong Jiang
|
|
Title:
|
POLISHING LIQUID FOR CMP AND PREPARATION METHOD AND USE THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 15 HONGFU INDUSTRY PARK, BEIQIJIA TOWN, CHANGPING DISTRICT |
| BEIJING, CHINA 102209 |
|
|
|
|
| FOLEY & LARDNER LLP |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
|
|
Search Results as of:
06/18/2024 04:08 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
