Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/17/2020
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Application #:
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16216247
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Filing Dt:
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12/11/2018
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Publication #:
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Pub Dt:
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06/20/2019
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Inventors:
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Yung-Chen Lin, Qingjun Zhou, Ying Zhang, Ho-yung David Hwang, Uday Mitra, Regina Freed
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Title:
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Selectively Etched Self-Aligned Via Processes
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD |
| SUITE 400 |
| WILMINGTON, NEW JERSEY 19808 |
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| SERVILLA WHITNEY LLC |
| 33 WOOD AVENUE SOUTH |
| SUITE 830 |
| ISELIN, NJ 08830 |
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