Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/07/2020
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Application #:
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16292289
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Filing Dt:
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03/04/2019
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Publication #:
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Pub Dt:
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06/27/2019
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Inventors:
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Qiwei LIANG, Srinivas D. NEMANI, Adib M. KHAN, Venkata Ravishankar KASIBHOTLA et al
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Title:
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HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD, SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| PATTERSON + SHERIDAN, LLP |
| 595 SHREWSBURY AVE |
| SUITE 100 |
| SHREWSBURY, NJ 07702 |
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