Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15956771
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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06/27/2019
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Inventors:
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Wai Kin Raymond Lam, Aibing Chen, Ho Wai Derek Leung, Weidong Gao
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Title:
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POWER MODULE WITH BUILT-IN POWER DEVICE AND DOUBLE-SIDED HEAT DISSIPATION AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, XI PU ROAD, XIN QING INDUSTRIAL PARK, DOUMEN DISTRICT, ZHUHAI CITY, GUANGDONG PROVINCE, 519100,CHINA |
| ZHUHAI, CHINA 519100 |
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| GOKALP BAYRAMOGLU |
| 2520 ST.ROSE PARKWAY, SUITE 309 |
| HENDERSON, NV 89074 |
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06/27/2024 01:31 AM
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