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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/25/2020
Application #:
16212156
Filing Dt:
12/06/2018
Publication #:
Pub Dt:
06/27/2019
Inventors:
James A. Burk, John Bultitude, Galen W. Miller
Title:
Higher Density Multi-Component and Serial Packages
Assignment: 1
Reel/Frame:
052923/0637Recorded: 06/12/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/14/2017
Exec Dt:
12/14/2017
Exec Dt:
12/14/2017
Assignee:
ONE EAST BROWARD BLVD.
2ND FLOOR
FORT LAUDERDALE, FLORIDA 33301
Correspondent:
PATENT FILING SPECIALIST INC.
16 WELLINGTON AVENUE
SUITE B
GREENVILLE, SC 29609

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