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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/24/2022
Application #:
16009266
Filing Dt:
06/15/2018
Publication #:
Pub Dt:
07/04/2019
Inventors:
CHIH-WEI LIAO, GUAN-SYUN TSENG, TSUNG-HSIEN LIN, JU-MING HUANG, CHEN-HUA YU
Title:
RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
Assignment: 1
Reel/Frame:
046116/0514Recorded: 06/18/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Assignee:
803, PO AI ST., CHUPEI CITY
HSINCHU COUNTY
R.O.C., TAIWAN
Correspondent:
FERRELLS, PLLC
P.O. BOX 312
CLIFTON, VA 20124-1706

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