Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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16330765
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Filing Dt:
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03/06/2019
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Publication #:
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Pub Dt:
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07/11/2019
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Inventors:
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Li ZHANG, Dong CHEN, Zhiming LAI, Hong XU, Jinhui CHEN, Qicai CHEN
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Title:
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CHIP PACKAGING STRUCTURE, AND PACKAGING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.99 CHENGJIANG EAST ROAD, HI-TECH INDUSTRIAL PARKS JIANGYIN, |
JIANGSU, CHINA 214429 |
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JCIP GLOBAL INC. |
20 PACIFICA, SUITE 220 |
IRVINE, CA 92618 |
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09/24/2024 05:39 AM
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