Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
08/13/2019
|
Application #:
|
15867720
|
Filing Dt:
|
01/11/2018
|
Publication #:
|
|
Pub Dt:
|
07/11/2019
| | | | |
Inventors:
|
Wei-Hau CHEN, Hsin-An CHEN
|
Title:
|
SOLID STATE DISK MODULE AND HEAT SINK DEVICE THEREOF
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5F., NO.14, WUGONG 5TH RD., WUGU DIST., |
NEW TAIPEI CITY, TAIWAN 248 |
|
|
|
HDLS IPR SERVICES |
P.O. BOX 230970 |
CENTREVILLE, VA 20120 |
|
|
Assignment:
2
|
|
|
|
ADDRESS CHANGED FOR ASSIGNEE
|
|
|
|
|
|
2F., NO. 43, WUGONG 5TH RD., WUGU DIST., |
NEW TAIPEI CITY, TAIWAN 248020 |
|
|
|
HDLS IPR SERVICES |
P.O. BOX 230970 |
CENTREVILLE, VA 20120 |
|
|
Search Results as of:
06/17/2024 08:07 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|