Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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16025913
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Filing Dt:
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07/02/2018
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Publication #:
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Pub Dt:
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07/25/2019
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Inventors:
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Kei-Wei Chen, Chih Hung Chen, Ying-Lang Wang
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Title:
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POLISHING PAD FOR CHEMICAL MECHANICAL PLANARIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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