Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16248069
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Filing Dt:
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01/15/2019
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Publication #:
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Pub Dt:
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07/25/2019
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Inventor:
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Shijie CHEN
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Title:
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Chip Package Assembly And Method For Manufacturing The Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE |
| PARK, NO. 90 WENSAN RD., HANGZHOU |
| ZHEJIANG, CHINA 310012 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
2
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| NO.6, LIANHUI STREET, XINXING SUB-DISTRICT |
| BINJIANG DISTRICT |
| HANGZHOU CITY, ZHEJIANG PROVINCE, CHINA 310051 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| 5445 CORPORATE DRIVE |
| SUITE 200 |
| TROY, MI 48098 |
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Assignment:
3
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| NO.6, LIANHUI STREET |
| XIXING SUB-DISTRICT, BINJIANG DISTRICT |
| HANGZHOU CITY, ZHEJIANG PROVINCE, CHINA 310051 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| 5445 CORPORATE DRIVE |
| SUITE 200 |
| TROY, MI 48098 |
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