Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2019
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Application #:
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15955527
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Filing Dt:
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04/17/2018
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Publication #:
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Pub Dt:
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08/01/2019
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Inventors:
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Yu-Min LIN, Shin-Yi HUANG, Tao-Chih CHANG
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Title:
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CHIP PACKAGE MODULE AND CIRCUIT BOARD STRUCTURE COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN 31040 |
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| NELSON QUINTERO |
| 615 HAMPTON DRIVE SUITE A202 |
| VENICE, CA 90291 |
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