Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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16393976
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Filing Dt:
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04/25/2019
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Publication #:
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Pub Dt:
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08/15/2019
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Inventor:
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Ying LIU
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Title:
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3D ULTRASOUND IMAGING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FLAT/RM E, 3/F, PO CHEONG BUILDING, 148-154 NAM CHEONG STREET, KOWLOON |
| HONG KONG, HONG KONG |
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| HENDERSON & WILL LIMITED |
| PO BOX 17, SHEK WU HUI POST OFFICE |
| NEW TERRITORIES |
| HONG KONG, HONG KONG |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 412-116, BLOCK B, TIANAN INNOVATION AND TECHNOLOGY PLAZA, PHASE I, TAIRAN 4TH ROAD |
| FUTIAN DISTRICT |
| SHENZHEN, CHINA 518040 |
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| HENDERSON & WILL |
| P.O. BOX 106-4 |
| GONGMING POST OFFICE, GUANGMING DISTRICT |
| SHENZHEN, GUANGDONG, 518106 CHINA |
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