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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/03/2021
Application #:
16273334
Filing Dt:
02/12/2019
Publication #:
Pub Dt:
08/15/2019
Inventors:
Chih-Hsiang HO, Yuval BEN-DOV, Yi LU, Teck Ping SIM
Title:
VIA PLACEMENT FOR SLIM BORDER ELECTRO-OPTIC DISPLAY BACKPLANES WITH DECREASED CAPACITIVE COUPLING BETWEEN T-WIRES AND PIXEL ELECTRODES
Assignment: 1
Reel/Frame:
048474/0149Recorded: 03/01/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/28/2018
Exec Dt:
02/27/2018
Exec Dt:
03/02/2018
Exec Dt:
03/02/2018
Assignee:
1000 TECHNOLOGY PARK DRIVE
BILLERICA, MASSACHUSETTS 01821-4165
Correspondent:
E INK CORPORATION
1000 TECHNOLOGY PARK DRIVE
ATTN: IP DEPARTMENT
BILLERICA, MA 01821-4165

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