Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16331965
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Filing Dt:
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03/09/2019
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Publication #:
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Pub Dt:
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08/15/2019
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Inventors:
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Sayaka Wakioka, Hidefumi Yasui, Shuujirou Sadanaga, Masahiro Itou, Shike Sou et al
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Title:
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CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-4, NISHITEMMA 2-CHOME, KITA-KU |
OSAKA-CITY, OSAKA, JAPAN 530-8565 |
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LEE CHENG |
1133 13TH STREET N.W. STE C2 |
WASHINGTON, DC 20005 |
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05/13/2024 03:34 AM
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