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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/05/2021
Application #:
15897833
Filing Dt:
02/15/2018
Publication #:
Pub Dt:
08/15/2019
Inventors:
Shu-Han YANG, Jai-Tai KUO, Sheng-Che CHIOU, Po-Chang CHEN
Title:
Power Device having a Substrate with Metal Layers Exposed at Surfaces of an Insulation Layer and Manufacturing Method Thereof
Assignment: 1
Reel/Frame:
044954/0965Recorded: 02/16/2018Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/04/2018
Exec Dt:
01/04/2018
Exec Dt:
01/04/2018
Exec Dt:
01/04/2018
Assignee:
NO. 5, LI HSIN 5TH RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
DITTHAVONG & STEINER P.C.
44 CANAL CENTER PLAZA
STE. 322
ALEXANDRIA, VA 22314

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