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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/28/2020
Application #:
15903015
Filing Dt:
02/22/2018
Publication #:
Pub Dt:
08/22/2019
Inventor:
Der-Min Yuan
Title:
METHOD FOR TESTING SEMICONDUCTOR DIE PAD UNTOUCHED BY PROBE AND RELATED TEST CIRCUIT
Assignment: 1
Reel/Frame:
045011/0977Recorded: 02/22/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/21/2017
Assignee:
9F-1, NO.89, DONGMEI RD., EAST DIST.
HSINCHU CITY, TAIWAN
Correspondent:
WINSTON HSU
5F., NO.389, FUHE RD., YONGHE DIST.,
NEW TAIPEI CITY, TAIWAN

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