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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/01/2020
Application #:
16404326
Filing Dt:
05/06/2019
Publication #:
Pub Dt:
08/22/2019
Inventors:
Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen et al
Title:
METHOD FOR IMPROVING CIRCUIT LAYOUT FOR MANUFACTURABILITY
Assignment: 1
Reel/Frame:
049093/0579Recorded: 05/06/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/16/2017
Exec Dt:
01/16/2017
Exec Dt:
01/16/2017
Exec Dt:
01/16/2017
Exec Dt:
01/17/2017
Exec Dt:
01/17/2017
Exec Dt:
01/16/2017
Exec Dt:
01/17/2017
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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