Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16396935
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Filing Dt:
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04/29/2019
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Publication #:
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Pub Dt:
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08/22/2019
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Inventors:
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Kim Heng Tan, Chan Wah Chai, Kwai Hong Wong
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Title:
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SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9TH FLOOR, UBN TOWER |
| NO. 10, JALAN P. RAMLEE |
| KUALA LUMPUR, MALAYSIA 50250 |
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| THOMAS M. LANDMAN |
| WIGGIN & DANA LLP |
| ONE CENTURY TOWER |
| NEW HAVEN, CT 06508-1832 |
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