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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10475702
Issue Dt:
11/12/2019
Application #:
15920727
Filing Dt:
03/14/2018
Publication #:
20190287851
Pub Dt:
09/19/2019
Inventors:
Pin-Wen CHEN, Chih-Wei CHANG, Ming-Hsing TSAI, Yu Shih WANG, I-Li CHEN, Chia-Han LAI et al
Title:
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
Assignment: 1
Reel/Frame:
045666/0594Recorded: 04/30/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, PIN-WEN
Exec Dt:
04/18/2018
LAI, CHIA-HAN
Exec Dt:
04/18/2018
CHANG, CHIH-WEI
Exec Dt:
04/18/2018
FU, MEI-HUI
Exec Dt:
04/18/2018
TSAI, MING-HSING
Exec Dt:
04/20/2018
LIN, WEI-JUNG
Exec Dt:
04/18/2018
WANG, YU SHIH
Exec Dt:
04/18/2018
CHENG, YA-YI
Exec Dt:
04/23/2018
CHEN, I-LI
Exec Dt:
04/19/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046

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