Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16464896
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Filing Dt:
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05/29/2019
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Publication #:
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Pub Dt:
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09/19/2019
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Inventors:
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Chuan Hu, Yuejin Guo, Junjun Liu, Edward Rudolph Prack
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Title:
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Integrated Circuit Packaging Structure and Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 601, BUILDING 2, ZHONGJIAN INDUSTRIAL BLDG. |
| NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTR. |
| SHENZHEN, GUANGDONG, CHINA 518067 |
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| BANNER & WITCOFF, LTD. |
| 1100 13TH ST. NW |
| STE 1200 |
| WASHINGTON, DC 20005 |
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