Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
11/08/2022
|
Application #:
|
16359059
|
Filing Dt:
|
03/20/2019
|
|
Publication #:
|
|
Pub Dt:
|
09/26/2019
| | | | |
|
Inventors:
|
Hiroshi SHIBATA, Souichi MATSUBARA, Jun KOIDE
|
|
Title:
|
WAFER GRINDING METHOD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1, TOYOTA-CHO, |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
|
|
|
| 13-11, OMORI-KITA 2-CHOME, OTA-KU, |
| TOKYO, JAPAN 143-8580 |
|
|
|
|
| GREER BURNS & CRAIN LTD |
| 300 S. WACKER DR. |
| SUITE 2500 |
| CHICAGO, IL 60606 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1 SHOWA-CHO, KARIYA-SHI |
| AICHI, JAPAN 448-8661 |
|
|
|
|
| GREER BURNS & CRAIN LTD |
| 300 S. WACKER DR. |
| CHICAGO, IL 60606 |
|
|
Search Results as of:
05/12/2024 12:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
