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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/16/2021
Application #:
16302299
Filing Dt:
11/16/2018
Publication #:
Pub Dt:
09/26/2019
Inventor:
Toru MEURA
Title:
THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND THREE-DIMENSIONAL MOLDED INTERCONNECT DEVICE
Assignment: 1
Reel/Frame:
047541/0607Recorded: 11/19/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/09/2018
Assignee:
5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
BIRCH STEWART KOLASH & BIRCH LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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