Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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16447835
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Filing Dt:
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06/20/2019
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Publication #:
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Pub Dt:
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10/03/2019
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Inventors:
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Chan H. Yoo, Mark E. Tuttle
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Title:
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Stress Tuned Stiffeners for Micro Electronics Package Warpage Control
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| PARSONS BEHLE & LATIMER - MICRON MICRON |
| 800 W. MAIN STREET |
| SUITE 1300 |
| BOISE, ID 83702 |
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