Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15955014
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Filing Dt:
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04/17/2018
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Publication #:
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Pub Dt:
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10/17/2019
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Inventors:
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SungSoo Kim, SangMi Park, DaeHyeok Ha
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Title:
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Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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| STATS CHIPPAC/PATENT LAW GROUP: ATKINS A |
| 55 N. ARIZONA PLACE, SUITE 104 |
| CHANDLER, AZ 85225 |
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