Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2023
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Application #:
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16360931
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Filing Dt:
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03/21/2019
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Publication #:
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Pub Dt:
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10/24/2019
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Inventors:
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Mikael Tuominen, Christian Vockenberger
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Title:
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Packaged Integrated Circuit With Interposing Functionality and Method for Manufacturing Such a Packaged Integrated Circuit
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 50 GLENLAKE PARKWAY |
| SUITE 340 |
| ATLANTA, GA 30328 |
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