Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/10/2020
|
Application #:
|
16509163
|
Filing Dt:
|
07/11/2019
|
|
Publication #:
|
|
Pub Dt:
|
10/31/2019
| | | | |
|
Inventors:
|
Takuo KISAKI, Masaki SUZUKI
|
|
Title:
|
ELECTRONIC COMPONENT HOUSING PACKAGE, MULTI-PIECE WIRING SUBSTRATE, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 6 TAKEDA TOBADONO-CHO |
| FUSHIMI-KU, KYOTO-SHI |
| KYOTO, JAPAN 612-8501 |
|
|
|
|
| DENNIS F. DEFINO JR. ESQUIRE |
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
05/23/2024 10:36 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
