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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10872868
Issue Dt:
12/22/2020
Application #:
16171239
Filing Dt:
10/25/2018
Publication #:
20190333881
Pub Dt:
10/31/2019
Inventors:
Chengchung LIN, Chengtar WU, Yenheng CHEN, Jangshen LIN, Chihon HO
Title:
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
Assignment: 1
Reel/Frame:
064599/0265Recorded: 08/15/2023Pages: 34
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, YENHENG
Exec Dt:
03/15/2019
LIN, CHENGCHUNG
Exec Dt:
03/15/2019
LIN, JANGSHEN
Exec Dt:
04/10/2019
WU, CHENGTAR
Exec Dt:
03/15/2019
HO, CHIHON
Exec Dt:
10/10/2016
Assignee:
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
78 CHANGSHAN AVENUE, HUAIYIN DISTRICT
JIANGYIN CITY, CHINA 214437
Correspondent:
ALSTON & BIRD, LLP
VANTAGE SOUTH END
1120 SOUTH TRYON STREET, SUITE 300
CHARLOTTE, NC 28203-6818

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