Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16473778
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Filing Dt:
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06/26/2019
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Publication #:
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Pub Dt:
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11/07/2019
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Inventors:
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Yeong Deuk SEO, Jee Kwon PARK, Jung Ki KIM, Yoo Jin JUNG, Sang Hyun HONG
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Title:
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Thermally-Conductive Resin Composition, and Complex Comprising Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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334-27, YEOSUSANDAN-RO |
YEOSU-SI, JEOLLANAM-DO |
YEOSU-SI, KOREA, REPUBLIC OF 59616 |
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ADDITON, HIGGINS & PENDLETON, P.A. |
10706 SIKES PLACE |
SUITE 350 |
CHARLOTTE, NC 28277 |
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