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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16470857
Filing Dt:
06/18/2019
Publication #:
Pub Dt:
11/07/2019
Inventors:
Xingchao Qi, Dapeng Zheng, Xianwen Tang, Koya Kato, Masashi Matsuda, Xinpu Zhang
Title:
RESIN COMPOSITION FOR BONDING METAL, PRODUCTION FORMED BY BONDING METAL WITH RESIN COMPOSITION, AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
049711/0379Recorded: 07/10/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/13/2019
Exec Dt:
06/11/2019
Exec Dt:
06/12/2019
Exec Dt:
06/20/2019
Exec Dt:
06/05/2019
Exec Dt:
06/10/2019
Assignee:
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 103-8666
Correspondent:
T. DANIEL CHRISTENBURY
ONE LIBERTY PLACE
1650 MARKET STREET, SUITE 5000
PHILADELPHIA, PA 19103

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