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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16522659
Filing Dt:
07/26/2019
Publication #:
Pub Dt:
11/14/2019
Inventors:
Yongbo YANG, Antonio Jr. Bambalan DIMAANO, Chun Hong WO
Title:
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
049866/0276Recorded: 07/26/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/12/2013
Exec Dt:
03/12/2013
Exec Dt:
03/12/2013
Assignee:
5 SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554916
Correspondent:
HORIZON IP PTE LTD
7500A BEACH ROAD, #04-306/308, THE PLAZA
SINGAPORE, 199591 SINGAPORE

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