Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/28/2020
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Application #:
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15991573
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Filing Dt:
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05/29/2018
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Publication #:
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Pub Dt:
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12/05/2019
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Inventors:
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Rahul Agarwal, Milind S. Bhagavat
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Title:
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DIE STACKING FOR MULTI-TIER 3D INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2485 AUGUSTINE DRIVE |
ATTN: LEGAL DEPARTMENT |
SANTA CLARA, CALIFORNIA 95054 |
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TIMOTHY HONEYCUTT, ATTORNEY AT LAW |
37713 PARKWAY OAKS LN. |
MAGNOLIA, TX 77355 |
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