Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16549301
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Filing Dt:
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08/23/2019
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Publication #:
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Pub Dt:
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12/12/2019
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Inventors:
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Robert L. Hubbard, Iftikhar Ahmad
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Title:
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Method for lower thermal budget multiple cures in semiconductor packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 860 AVIATION PARKWAY |
| SUITE 900 |
| MORRISVILLE, NORTH CAROLINA 27560 |
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| MOSER TABOADA/ALAN TABOADA |
| 1030 BROAD STREET |
| SUITE 203 |
| SHREWSBURY, NJ 07702 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| MOSER TABOADA/ALAN TABOADA |
| 1030 BROAD STREET |
| SUITE 203 |
| SHREWSBURY, NJ 07702 |
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