Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/2022
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Application #:
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16471904
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Filing Dt:
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06/20/2019
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Publication #:
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Pub Dt:
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12/19/2019
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Inventors:
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Haishen KONG, Yubin LIN, Jinxin SHEN, Xinfu LIANG, Qingyun ZHOU
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Title:
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PACKAGE-BEFORE-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE ELECTRICALLY CONNECTED BY PLATED COPPER PILLARS AND PROCESS THEREOF
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Assignment:
1
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| NO. 275 BINJIANG MIDDLE ROAD |
| JIANGYIN |
| JIANGSU, CHINA 214400 |
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| LADAS & PARRY LLP |
| 4525 WILSHIRE BLVD # 240 |
| LOS ANGELES, CA 90010 |
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