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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/05/2022
Application #:
16553698
Filing Dt:
08/28/2019
Publication #:
Pub Dt:
12/19/2019
Inventors:
Eiichi Nakano, Shiro Uchiyama
Title:
SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF OPERATION
Assignment: 1
Reel/Frame:
050200/0421Recorded: 08/28/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/08/2018
Exec Dt:
05/14/2018
Assignee:
8000 SOUTH FEDERAL WAY
MAILSTOP 1-507
BOISE, IDAHO 83707-0006
Correspondent:
TRASK BRITT, P.C./ MICRON TECHNOLOGY
P.O. BOX 2550
SALT LAKE CITY, UT 84110

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