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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16539848
Filing Dt:
08/13/2019
Publication #:
Pub Dt:
12/26/2019
Inventors:
Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
Title:
POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
Assignment: 1
Reel/Frame:
054423/0378Recorded: 11/19/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/05/2018
Exec Dt:
05/17/2018
Exec Dt:
04/11/2018
Exec Dt:
05/08/2018
Assignee:
1800 GRANT STREET
8TH FLOOR
DENVER, COLORADO 80203
Correspondent:
SANDERS IP
240 N EAST PROMONTORY
SUITE 200
FARMINGTON, UT 84025

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