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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10666843
Issue Dt:
05/26/2020
Application #:
16165824
Filing Dt:
10/19/2018
Publication #:
20190394366
Pub Dt:
12/26/2019
Inventors:
SHIN-WEN CHEN, XIAO-MEI MA, KUN LI, LONG-FEI ZHANG
Title:
IMAGING CHIP PACKAGING STRUCTURE AND CAMERA DEVICE HAVING THE SAME
Assignment: 1
Reel/Frame:
047240/0031Recorded: 10/19/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LI, KUN
Exec Dt:
10/09/2018
CHEN, SHIN-WEN
Exec Dt:
10/09/2018
ZHANG, LONG-FEI
Exec Dt:
10/09/2018
MA, XIAO-MEI
Exec Dt:
10/09/2018
Assignees:
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
B2 BUILDING FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN
SHENZHEN, CHINA
HON HAI PRECISION INDUSTRY CO., LTD.
66, CHUNG SHAN ROAD, TU-CHENG DIST.
NEW TAIPEI, TAIWAN
Correspondent:
KELVIN LIU
550 S. HOPE STREET, SUITE 2825
LOS ANGELES, CA 90071
Assignment: 2
Reel/Frame:
049312/0315Recorded: 05/29/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Exec Dt:
05/14/2019
HON HAI PRECISION INDUSTRY CO., LTD.
Exec Dt:
05/14/2019
Assignee:
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
B2 BUILDING, FOXCONN TECHNOLOGY GROUP, DONGHUAN 2ND ROAD,LONGHUA TOWN
SHENZHEN, CHINA
Correspondent:
CALVIN H CHAI
550 S. HOPE STREET, SUITE 2825
LOS ANGELES, CA 90071

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