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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16024413
Filing Dt:
06/29/2018
Publication #:
Pub Dt:
01/02/2020
Inventors:
Andreas Augustin, Georg Seidemann, Thomas Wagner, Bernd Waidhas
Title:
THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSEMBLING SAME
Assignment: 1
Reel/Frame:
049505/0409Recorded: 06/18/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/17/2018
Exec Dt:
07/12/2018
Exec Dt:
07/11/2018
Exec Dt:
07/11/2018
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
056543/0359Recorded: 06/10/2021Pages: 108
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/12/2021
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ANGELA MILLER
C/O CPA GLOBAL
900 SECOND AVENUE SOUTH, SUITE 600
MINNEAPOLIS, MN 55402

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