Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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16465455
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Inventors:
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Chuan HU, Junjun LIU, Yuejin GUO, Edward Rudolph PRACK
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Title:
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Integrated circuit system and packaging method therefor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RM. 601, BUILDING 2, ZHONGJIAN INDUSTRIAL BUILDING, |
| NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTRICT, |
| SHENZHEN, GUANGDONG, CHINA 518067 |
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| BENJAMIN C. ARMITAGE |
| 7401 METRO BLVD. |
| SUITE 425 |
| MINNEAPOLIS, MN 55439 |
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05/23/2024 08:37 PM
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