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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16490245
Filing Dt:
08/30/2019
Publication #:
Pub Dt:
01/09/2020
Inventor:
Chengguo LI
Title:
Method and Device for Manufacturing Dissolving Microneedle
Assignment: 1
Reel/Frame:
050244/0528Recorded: 08/30/2019Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/28/2019
Assignee:
9B, BUILDING 4, CEC HIGH-TECH INDUSTRIAL PARK, NO. 1, KEJI 7TH RD., TANGJIAWAN TOWN, HIGH-TECH DISTRICT,
ZHUHAI, GUANGDONG, CHINA 519000
Correspondent:
HAYES SOLOWAY PC
175 CANAL STREET
5TH FLOOR
MANCHESTER, NH 03101

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