Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16034770
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Filing Dt:
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07/13/2018
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Publication #:
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Pub Dt:
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01/16/2020
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Inventors:
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Jonathan J. Bernstein, Daniel Freeman, Peter Q. Miraglia, Steven J. Byrnes
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Title:
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Chip Scale Encapsulated Vacuum Field Emission Device Integrated Circuit and Method of Fabrication Therefor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 555 TECHNOLOGY SQUARE |
| CAMBRIDGE, MASSACHUSETTS 02139 |
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| JOSEPH GRANT HOUSTON |
| HOUSTONHOGLE LLP |
| 1666 MASSACHUSETTS AVE, SUITE 12 |
| LEXINGTON, MA 02420 |
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