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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/13/2020
Application #:
16280186
Filing Dt:
02/20/2019
Publication #:
Pub Dt:
01/16/2020
Inventors:
YEONG-KWON KO, JUN-YEONG HEO, UN-BYOUNG KANG, JA-YEON LEE
Title:
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING MODIFIED REGION OF LESS DENSITY AT EDGE OF DEVICE OR SUBSTRATE
Assignment: 1
Reel/Frame:
048388/0685Recorded: 02/20/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/19/2018
Exec Dt:
12/19/2018
Exec Dt:
12/19/2018
Exec Dt:
12/19/2018
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
VOLENTINE, WHITT & FRANCOS, PLLC
11951 FREEDOM DRIVE, SUITE 1300
RESTON, VA 20190

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