Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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16578358
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Filing Dt:
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09/22/2019
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Publication #:
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Pub Dt:
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01/16/2020
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Inventors:
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Chun-Hao Tseng, Ying-Hao Kuo, Kuo-Chung Yee
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Title:
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THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & POTASHNIK, LLC |
| ROSETTA CENTER |
| 629 EUCLID AVE., SUITE 1000 |
| CLEVELAND, OH 44114 |
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