Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16581866
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Filing Dt:
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09/25/2019
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Publication #:
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Pub Dt:
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01/16/2020
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Inventors:
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Jeong Wan Kim, Hyunki Cho
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Title:
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Partially Molded Substrate And Partial Molding Device And Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO |
| YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DRIVE |
| CRANFORD, NJ 07016 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PARC. 1, TOWER ONE |
| 108 YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07335 |
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| DENTONS US LLP |
| 1900 K STREET NW |
| WASHINGTON, DC 20006 |
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