Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16584719
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Filing Dt:
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09/26/2019
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Publication #:
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Pub Dt:
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01/23/2020
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Inventors:
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Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen et al
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Title:
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WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SMART CAP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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ESCHWEILER & POTASHNIK, LLC |
ROSETTA CENTER |
629 EUCLID AVE., SUITE 1000 |
CLEVELAND, OH 44114 |
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05/30/2024 08:42 AM
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