Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/11/2020
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Application #:
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16392388
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Filing Dt:
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04/23/2019
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Publication #:
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Pub Dt:
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01/30/2020
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Inventors:
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Jin Won JEONG, Hye Ji LEE, Jae Sik CHOI, Do Young KIM, Byeung Soo SONG
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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Assignment:
2
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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15F, 76 JIKJI-DAERO, 436BEON-GIL (JIKJI SMART TOWER), HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28581 |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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