Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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16054755
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Filing Dt:
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08/03/2018
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Publication #:
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Pub Dt:
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02/06/2020
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Inventors:
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Benjamin James Kerr, Philip Rose, Robert Reed
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Title:
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SERIAL INTERFACE FOR SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25B-C WESTERN AVENUE, MILTON PARK, ABINGDON |
| OXON, UNITED KINGDOM OX14 4SH |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W., SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5231 CALIFORNIA AVENUE |
| IRVINE, CALIFORNIA 92617 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W., SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-21, SHIBAURA 3-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W., SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8001 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W., SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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05/08/2024 02:35 PM
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