Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16600630
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Filing Dt:
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10/14/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Inventors:
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Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng et al
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Title:
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High-Density Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD, VI |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| JONES DAY |
| 250 VESEY STREET |
| NEW YORK, NY 10281-1047 |
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